Job Description

The Collaterals and Media Development team is focused on the developing and sustaining various transportation packaging (media) and precision material handling equipment end effector designs (collaterals). These parts will be used throughout the semiconductor manufacturing line primarily in the Wafer Level Assembly space.

A Module Development Engineer on this team will have projects for both Collaterals and Media Development, depending on the skillset and needs of the team at any given time.

Collaterals Development responsibilities include, but are not limited to, the following:

• Creating 2D and 3D CAD of collaterals and other equipment

• Generating CAD Drawings with accurate GD and T callouts

• Performing mechanical design analysis and simulations (Mechanical, Thermal, and Fluid)

• Documenting findings and qualifying design rules

• Establishing DOEs

• Conducting research for applicable materials

• Working with vendors, global supply chain, and quality engineers to establish material specifications and ensure material quality and vendor performance

• Ensuring solutions are viable for future products

• Providing consultation as packaging problems arise and suggesting improvements to the process line

• Interacting with customer when new requests or events occur

• Developing novel solutions to problems utilizing a first principles approach

Media Development responsibilities include, but are not limited to, the following:

• Developing and sustaining new/existing media

• Working with various suppliers

• Supporting our partners and stakeholders to ensure operational performance (data collection, statistical analysis, etc.)

• Performing root cause analysis when issues arise and identifying a solution path

• Works to develop robust design to be used in current and future products

• Advising on packaging related problems and identifying potential process improvements

• Interacting with customer when new requests or events occur

• Developing novel solutions to problems utilizing a first principles approach

• Performing statistical design of experiments and applying problem solving techniques to qualify and document changes in White Papers

The current requisition is being targeted for 80 percent Collaterals and 20 percent Media work, however the role can shift as projects change.

Qualifications

For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information (https://www.intel.com/content/www/us/en/jobs/hiring.html) .

You must possess the below requirements to be initially considered for this position.

Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:

• Possess a Bachelor's degree in mechanical engineering or a related STEM field with 3+ years of relevant work experience in one of the following areas:

• 3+ years in Mechanical Design

• RSS Analysis

• Geometric Dimensioning and Tolerancing

• 2+ years Finite Eliminate Analysis

• Process and/or Shipping Media Design

• 1+ Year Mechanical Lab Testing (Failure Analysis, Accelerated Life Testing, Drop, Shock and Vibe Testing, etc.)

Preferred Qualifications:

• Possess a Master's degree in Mechanical Engineering or a related STEM field with 3+ years of relevant work experience in the following areas:

• Mechanical Design

• RSS Analysis

• Geometric Dimensioning and Tolerancing

• Finite Eliminate Analysis

• Process and/or Shipping Media Design

• Mechanical Lab Testing (Failure Analysis, Accelerated Life Testing, Drop, Shock and Vibe Testing, etc.)

• Material handling systems, including high speed/accuracy pick and place, motion control, and vision systems

• Fundamental science and engineering concepts in development to create a novel design solutions for high volume manufacturing process

• Stakeholder management (external supplier/project management/internal partner management)

• Semiconductor devices and packaging processes and technology

• Technical and analytical skills, with knowledge of statistical design of experiments and problem solving techniques

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. (https://jobs.intel.com/en/benefits)

Working Model

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.